標(biāo)準(zhǔn)號：ISO 9455-17-2002
中文標(biāo)準(zhǔn)名稱：軟釬焊劑.試驗(yàn)方法.第17部分:釬焊劑殘留物的表面絕緣電阻梳試驗(yàn)和電化學(xué)遷移試驗(yàn)
英文標(biāo)準(zhǔn)名稱：Soft soldering fluxes - Test methods - Part 17: Surface insulation resistance comb test and electrochemical migration test of flux residues
標(biāo)準(zhǔn)類型：J33
發(fā)布日期：1999/12/31 12:00:00
實(shí)施日期：1999/12/31 12:00:00
中國標(biāo)準(zhǔn)分類號：J33
國際標(biāo)準(zhǔn)分類號：25.160.50
適用范圍：This part of ISO 9455 specifies a method of testing for deleterious effects that may arise from flux residues after soldering or tinning test coupons. The test is applicable to type 1 and type 2 fluxes, as specified in ISO 9454-1, in solid or liquid form, or in the form of flux-cored solder wire, solder preforms or solder paste constituted with eutectic or near-eutectic tin/lead (Sn/Pb) solders (ISO 9453:1990, Class E). NOTE This test method is also applicable to fluxes for use with lead-free solders. However, the soldering temperatures may be adjusted with agreement between tester and customer.