標準號：BS EN 60749-19-2003+A1-2010
中文標準名稱：半導體器件.機械和氣候試驗方法.模剪切強度
英文標準名稱：Semiconductor devices. Mechanical and climatic test methods. Die shear strength
標準類型：L40
發(fā)布日期：2003/6/20 12:00:00
實施日期：2003/6/20 12:00:00
中國標準分類號：L40
國際標準分類號：31.080.01
適用范圍：This part of IEC 60749 determines (see note) the integrity of materials and procedures usedto attach semiconductor die to package headers or other substrates (for the purpose of thistest method, the term “semiconductor die” should be taken to include passive elements).This test method is generally only applicable to cavity packages or as a process monitor. It isnot applicable for die areas greater than 10 mm2. It is also not applicable to flip chiptechnology or to flexible substrates.