標(biāo)準(zhǔn)號(hào)：BS EN 60191-6-6-2001
中文標(biāo)準(zhǔn)名稱(chēng)：半導(dǎo)體器件的機(jī)械標(biāo)準(zhǔn)化.表面安裝半導(dǎo)體器件封裝外形圖繪制的一般規(guī)則.小爆距紋間表面網(wǎng)格陣列(FLAG)的設(shè)計(jì)指南.術(shù)語(yǔ)推薦修改
英文標(biāo)準(zhǔn)名稱(chēng)：Mechanical standardization of semiconductor devices - General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA) - Proposed amendment on terminology
標(biāo)準(zhǔn)類(lèi)型：L40
發(fā)布日期：2001/9/5 12:00:00
實(shí)施日期：2001/9/5 12:00:00
中國(guó)標(biāo)準(zhǔn)分類(lèi)號(hào)：L40
國(guó)際標(biāo)準(zhǔn)分類(lèi)號(hào)：01.100.25;31.240
適用范圍：This part of IEC 60191 provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch land grid array (hereinafter called FLGA) whose terminal pitch is less than, or equal to, 0,80 mm and whose package body outline is square.