標(biāo)準(zhǔn)號(hào)：DIN EN 62137-2005
中文標(biāo)準(zhǔn)名稱(chēng)：環(huán)境和耐久性試驗(yàn).區(qū)域陣列式包裝件表面安裝板的試驗(yàn)方法FBGA、BGA、FLGA、LGA、SON和QFN
英文標(biāo)準(zhǔn)名稱(chēng)：Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN (IEC 62137:2004 + Corrigendum:2005); German version EN 62137:2004
標(biāo)準(zhǔn)類(lèi)型：A21
發(fā)布日期：1999/12/31 12:00:00
實(shí)施日期：2005/4/1 12:00:00
中國(guó)標(biāo)準(zhǔn)分類(lèi)號(hào)：A21
國(guó)際標(biāo)準(zhǔn)分類(lèi)號(hào)：31.020
適用范圍：This Standard specifies the test method and guidelines for evaluating the quality and reliability of boards, solder lands, solder process and solder joints of reflow solder mounted area array type packages an peripheral terminal type packages.