標(biāo)準(zhǔn)號(hào)：BS EN 60068-2-54-2006
中文標(biāo)準(zhǔn)名稱(chēng)：環(huán)境試驗(yàn).試驗(yàn).試驗(yàn)Ta:使用潤(rùn)濕平衡法對(duì)電子部件進(jìn)行軟焊性測(cè)試
英文標(biāo)準(zhǔn)名稱(chēng)：Environmental testing - Tests - Test Ta: Solderability testing of electronic components by the wetting balance method
標(biāo)準(zhǔn)類(lèi)型：A21
發(fā)布日期：2006/9/29 12:00:00
實(shí)施日期：2006/9/29 12:00:00
中國(guó)標(biāo)準(zhǔn)分類(lèi)號(hào)：A21
國(guó)際標(biāo)準(zhǔn)分類(lèi)號(hào)：19.040
引用標(biāo)準(zhǔn)：IEC 60068-1-1988;IEC 60068-2-20-1979;IEC 61190-1-3
適用范圍：This part of IEC 60068 outlines Test Ta, solder bath wetting balance method applicable for anyshape of component terminations to determine the solderability. It is especially suitable forreference testing and for components that cannot be quantitatively tested by other methods.For surface mounting devices (SMD), IEC 60068-2-69 should be applied if it is suitable.This standard provides the standard procedures for solder alloys containing lead (Pb) and forlead-free solder alloys.