標(biāo)準(zhǔn)號(hào)：BS EN 61249-8-8-1997
中文標(biāo)準(zhǔn)名稱：連接結(jié)構(gòu)用材料.非導(dǎo)電膜和涂層分規(guī)范.臨時(shí)聚合物規(guī)范
英文標(biāo)準(zhǔn)名稱：Materials for interconnection structures - Sectional specification set for non-conductive films and coatings - Temporary polymer coatings
標(biāo)準(zhǔn)類型：L30
發(fā)布日期：1997/12/15 12:00:00
實(shí)施日期：1997/12/15 12:00:00
中國(guó)標(biāo)準(zhǔn)分類號(hào)：L30
國(guó)際標(biāo)準(zhǔn)分類號(hào)：31.180
適用范圍：This specification within the IEC 61249 series details requirements for the qualification of temporary solder resist coatings. These have been referred to as a mask in this specification since they have the facility of being readily removed. Peelable solder masks are applied (usually by screen printing) to areas of a completed printed board or panel prior to shipment, in order to protect areas of the board or panel during subsequent processes by the board assembler. Typically, peelable solder masks are used to protect keypad contacts during fluxing and subsequent mass soldering. Removal of the mask will then leave a residue-free untinned contact area. Requirements stated in this specification will also have some limited validity for assessing the suitability of printed boards which are supplied with peelable solder masks. Requirements for the release of printed boards using peelabie solder masks should be included in the Customer Detail Specification (CDS). Requirements for the qualification of permanent polymeric solder resistive coatings are given in IEC 61249-8-5