標(biāo)準(zhǔn)號(hào)：BS EN 165000-4-1996
中文標(biāo)準(zhǔn)名稱(chēng)：薄膜集成電路和混合集成電路.用戶(hù)信息,產(chǎn)品評(píng)估第級(jí)一覽表和空白詳細(xì)規(guī)范
英文標(biāo)準(zhǔn)名稱(chēng)：Film and hybrid integrated circuits. Customer information, product assessment level schedules and blank detail specification
標(biāo)準(zhǔn)類(lèi)型：L57;L58
發(fā)布日期：1996/10/15 12:00:00
實(shí)施日期：1996/10/15 12:00:00
中國(guó)標(biāo)準(zhǔn)分類(lèi)號(hào)：L57;L58
國(guó)際標(biāo)準(zhǔn)分類(lèi)號(hào)：31.200
適用范圍：Film and hybrid integrated circuits Part 4. Customer information, product assessment level schedules and blank detail specification 1 Introduction 1.1 How EN 165000 works 1.2 Customer/manufacturer interface 1.3 The product assessment level schedules 1.3.1 Derivation of the product assessment level schedules 1.3.2 Indication of applications for the product assessment level schedules 1.4 Test requirements of the PALS and their applicability to real life application 1.4.1 The origin of the inspection requirements 1.4.2 Electrical tests 1.4.3 Other screening tests 1.4.4 Device sample testing 1.4.5 Design evaluation testing 1.4.6 AQLs, inspection levels and sampling plans 2 Product assessment level schedules and detail specifications PALS 1-11 3 Blank detail specification requirements Front page for standard catalogue circuits Front page for customer circuits Section one —general data Section two —inspection requirements Example of a customer detail specification Tables 1 PALS for solder or chip & wire (non-hermetic) assembly 2 PALS for chip & wire (hermetic) assembly