標(biāo)準(zhǔn)號(hào)：IEC 60068-2-58 Edition 4.1-2017
中文標(biāo)準(zhǔn)名稱：環(huán)境試驗(yàn).第2-58部分:試驗(yàn).試驗(yàn)Td:表面安裝元器件(SMD)用可焊性、耐金屬化溶融和耐焊接熱的試驗(yàn)方法
英文標(biāo)準(zhǔn)名稱：Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
標(biāo)準(zhǔn)類型：A21
發(fā)布日期：1999/12/31 12:00:00
實(shí)施日期：1999/12/31 12:00:00
中國(guó)標(biāo)準(zhǔn)分類號(hào)：A21
國(guó)際標(biāo)準(zhǔn)分類號(hào)：19.040;31.190
引用標(biāo)準(zhǔn)：IEC 60068-1-2013;IEC 60068-2-20-2008;IEC 60194-2015;IEC 61190-1-1-2002;IEC 61190-1-2-2014;IEC 61190-1-3-2007;IEC 61190-1-3 AMD 1-2010;IEC 61191-2-2017;IEC 61249-2-22-2005;IEC 61249-2-35-2008;IEC 61760-1-2006;ISO 9454-2-1998
適用范圍：This part of IEC 60068 outlines test Td, applicable to surface mounting devices (SMD). This standard document provides procedures for determining the solderability, resistance to dissolution of metallization and resistance to soldering heat of devices in applications using solder alloys, which are eutectic or near eutectic tin lead (Pb), or lead-free alloys. The procedures use either a solder bath or reflow method and are applicable only to specimens or products designed to withstand short term immersion in molten solder or limited exposure to reflow systems. The solder bath method is applicable to SMDs designed for flow soldering and SMDs designed for reflow soldering when the solder bath (dipping) method is appropriate. The reflow method is applicable to the SMD designed for reflow soldering, to determine the suitability of SMDs for reflow soldering and when the solder bath (dipping) method is not appropriate. The objective of this standard is to ensure solderability of component lead or termination. In addition, test methods are provided to ensure that the component body can resist against the heat load to which it is exposed during soldering. This standard covers tests Td1, Td2 and Td3 as listed below: Number of Td Test Method Td1 Solderability of terminations Method 1: Solder bath Method 2: Reflow Td2 Resistance to soldering heat Method 1: Solder bath Method 2: Reflow Td3 Dewetting and resistance to dissolution of metallization Method 1: Solder bath Method 2: Reflow NOTE 1 For specific components other test methods may exist. NOTE 2 Test Td does not apply to printed wiring board (PWB), see IEC 61189-3. NOTE 3 Specific through-hole devices (where the device supplier has specifically documented support for reflow soldering) are also included in this standard.