標(biāo)準(zhǔn)號(hào)：BS EN 61190-1-3-2007+A1-2010
中文標(biāo)準(zhǔn)名稱：電子組件用連接材料.電子焊接用電子級(jí)釬焊合金及有焊劑和無焊劑的固體焊料用要求
英文標(biāo)準(zhǔn)名稱：Attachment materials for electronic assembly. Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
標(biāo)準(zhǔn)類型：J33
發(fā)布日期：2007/7/31 12:00:00
實(shí)施日期：2007/7/31 12:00:00
中國(guó)標(biāo)準(zhǔn)分類號(hào)：J33
國(guó)際標(biāo)準(zhǔn)分類號(hào)：31.190
適用范圍：This part of IEC 61190 prescribes the requirements and test methods for electronic gradesolder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, forelectronic soldering applications and for “special” electronic grade solders. For the genericspecifications of solder alloys and fluxes, see ISO 9453, ISO 9454-1 and ISO 9454-2. Thisstandard is a quality control document and is not intended to relate directly to the material'sperformance in the manufacturing processSpecial electronic grade solders include all solders which do not fully comply with therequirements of standard solder alloys and solder materials listed herein. Examples of specialsolders include anodes, ingots, preforms, bars with hook and eye ends, multiple-alloy solderpowders, etc.