標準號：BS 6221-25-2000
中文標準名稱：印制電路板.釬焊表面安裝印制板組件的檢修和再加工指南
英文標準名稱：Printed wiring boards - Guide to the rework and repair of soldered surface mounted printed board assemblies
標準類型：L30
發布日期：2000/11/15 12:00:00
實施日期：2000/11/15 12:00:00
中國標準分類號：L30
國際標準分類號：31.180
適用范圍：This part of BS 6221 gives guidance on the procedures to be adopted in the rework of soldered surface mounted printed board assemblies. It is applicable to activities specific to the processes used to manufacture soldered surface mounted assemblies on printed boards and to the relevant parts of resulting products. The standard is also applicable to activities that can form part of the work in assembling mixed technology products. The guidance given in the standard on rework activities is also applicable to repair. This part of BS 6221 also contains guidance on design matters where they have relevance to rework. NOTE Typical in-process surface mount rework activities to which this standard applies are shown in Figure 1.