標(biāo)準(zhǔn)號(hào)：IEC 60068-2-69-2007
中文標(biāo)準(zhǔn)名稱：環(huán)境測試.第2-69部分:試驗(yàn).試驗(yàn)Te:用潤濕稱量法進(jìn)行表面安裝裝置(SMD)的電子元件的可焊性測試
英文標(biāo)準(zhǔn)名稱：Environmental testing - Part 2-69: Tests - Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method
標(biāo)準(zhǔn)類型：L04
發(fā)布日期：1999/12/31 12:00:00
實(shí)施日期：1999/12/31 12:00:00
中國標(biāo)準(zhǔn)分類號(hào)：L04
國際標(biāo)準(zhǔn)分類號(hào)：19.040;31.190
適用范圍：This part of IEC 60068 outlines test Te, solder bath wetting balance method and solderglobule wetting balance method, applicable for surface mounting devices. These methodsdetermine quantitatively the solderability of terminations on surface mounting devices.IEC 60068-2-54 is also available for surface mounting devices and should be consulted ifapplicable.The procedures describe the solder bath wetting balance method and the solder globulewetting balance method and are both applicable to components with metallic terminations andmetallized solder pads.This standard provides the standard procedures for solder alloys containing lead (Pb) and forlead-free solder alloys.