標準號：BS EN ISO 9455-17-2003
中文標準名稱：軟釬焊劑.試驗方法.焊劑殘留物的表面絕緣電阻梳試驗和電化學遷移試驗
英文標準名稱：Soft soldering fluxes - Test methods - Surface insulation resistance comb test and electrochemical migration test of flux residues
標準類型：J33
發布日期：2003/3/21 12:00:00
實施日期：2003/3/21 12:00:00
中國標準分類號：J33
國際標準分類號：25.160.50
適用范圍：ISO 9455-17:2002 specifies a method of testing for deleterious effects that may arise from flux residues after soldering or tinning test coupons. The test is applicable to type 1 and type 2 fluxes in solid or liquid form, or in the form of flux-cored solder wire, solder preforms or solder paste constituted with eutectic or near-eutectic tin/lead solders.This test method is also applicable to fluxes for use with lead-free solders. However, the soldering temperatures may be adjusted with agreement between tester and customer.