標準號：BS ISO 9455-17-2003
中文標準名稱：釬焊劑.試驗方法.表面絕緣電阻梳子試驗和釬焊劑殘留物電化學遷移試驗
英文標準名稱：Soft soldering fluxes - Test methods - Surface insulation resistance comb test and electrochemical migration test of flux residues
標準類型：J33
發布日期：2003/3/21 12:00:00
實施日期：2003/3/21 12:00:00
中國標準分類號：J33
國際標準分類號：25.160.50
適用范圍：This part of ISO 9455 specifies a method of testing for deleterious effects that may arise from flux residues after soldering or tinning test coupons. The test is applicable to type 1 and type 2 fluxes, as specified in ISO 9454-1, in solid or liquid form, or in the form of flux-cored solder wire, solder preforms or solder paste constituted with eutectic or near-eutectic tin/lead (Sn/Pb) solders (ISO 9453:1990, Class E). NOTE This test method is also applicable to fluxes for use with lead-free solders. However, the soldering temperatures may be adjusted with agreement between tester and customer.