標(biāo)準(zhǔn)號：BS EN 62137-1-5-2009
中文標(biāo)準(zhǔn)名稱：表面安裝技術(shù).表面安裝焊接點的環(huán)境和耐受試驗方法.第1-5部分:機械剪切疲勞試驗
英文標(biāo)準(zhǔn)名稱：Surface mounting technology - Environmental and endurance test methods for surface mount solder joints - Part 1-5:Mechanical shear fatigue test
標(biāo)準(zhǔn)類型：L10
發(fā)布日期：2009/7/31 12:00:00
實施日期：2009/7/31 12:00:00
中國標(biāo)準(zhǔn)分類號：L10
引用標(biāo)準(zhǔn)：IEC 60068-1;IEC 60088-5;IEC 60194;IEC 61190-1-2-2007;IEC 61190-1-3;IEC 61249-2-7-2002;IEC 61760-1
適用范圍：The test method described in this part of IEC 62137 applies to area array packages, such as BGA. This test method is designed to evaluate the fatigue life of the solder joints between component leads and lands on a substrate as shown in Figure 1. A temperature cyclic approach is generally used to evaluate the reliability of solder joints. Another method is to mechanically cycle the solder joints to shorten the testing time rather than to produce thestrains by changing temperatures. The methodology is the imposition of shear deformation on the solder joints by mechanical displacement instead of relative displacement generated by CTE (coefficient of thermal expansion) mismatch, as shown in Figure 2. In place of the temperature cycle test, the mechanical shear fatigue predicts the reliability of the solder joints under repeated temperature change conditions by mechanically cycling the solder joints. In this test method, the evaluation requires first to mount the surface mount component on thesubstrate by reflow soldering, then cyclic mechanical shear deformation is applied to thesolder joints until fracture of the solder joints occurs. The properties of the solder joints (forexample solder alloy, substrate, mounted device or design, etc.) are evaluated to assist in improving the strength of the solder joints.